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About this Engineering article
Stress Analysis of Film during Molding Shape by the Packaging Machine by MORIMURA, Hiroaki; TERASHIMA, Yosiki; HAGIWARA, Ichiro is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- MORIMURA, Hiroaki; TERASHIMA, Yosiki; HAGIWARA, Ichiro
- Publisher
- The Japan Society of Mechanical Engineers; Japan Society of Mechanical Engineers/Nihon Kikai Gakkai; Japan Society of Mechanical Engineers (ISSN 0387-5024)
- Published
- 2012
- Field
- Engineering (Physical Sciences)