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About this scholarly article
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Chip scale packaging and redistribution by Magill, P.A.; Machon, W.C.; Rinne, G.A.; Mis, J.D.; Baggs, J.W. is a scholarly article available to read on EtoBox.
- Author
- Magill, P.A.; Machon, W.C.; Rinne, G.A.; Mis, J.D.; Baggs, J.W.
- Publisher
- IEEE
- Published
- 1998
- Language
- EN
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