About this scholarly article

2013 IEEE 63rd Electronic Components and Technology Conference - Development of 3D through silicon stack (TSS) assembly for wide IO memory to logic devices integration by Kim, Dong Wook; Vidhya, Ramachandran; Henderson, Brian; Ray, Urmi; Gu, Sam; Zhao, Wei; Radojcic, Riko; Nowak, Matt is a scholarly article available to read on EtoBox.

Author

Kim, Dong Wook; Vidhya, Ramachandran; Henderson, Brian; Ray, Urmi; Gu, Sam; Zhao, Wei; Radojcic, Riko; Nowak, Matt

Publisher

IEEE

Published

2013

Language

EN