About this scholarly article

SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Monday 18 September 2000)] Challenges in Process Integration and Device Technology - Low-k etch/ash for copper dual damascene by Suemasa, Tomoki; Nishino, Masaru; Inazawa, Kouichiro; Balasubramanian, Vaidyanathan; Nishimura, Eiichi; Burnett, David; Kimura, Shin'ichiro; Singh, Bhanwar is a scholarly article available to read on EtoBox.

Author

Suemasa, Tomoki; Nishino, Masaru; Inazawa, Kouichiro; Balasubramanian, Vaidyanathan; Nishimura, Eiichi; Burnett, David; Kimura, Shin'ichiro; Singh, Bhanwar

Publisher

SPIE

Published

2000