About this document
PSM for SOIC Package Crack Reduction by Vbaluyo is a document available to read on EtoBox.
This document describes a problem-solving methodology used to address customer complaints of package chip-outs and cracks in SOIC packages. Step 1 defines the problem as chip-outs and cracks occurring in four locations on SOIC packages. Step 2 shows trends over time and a goal of zero occurrences. Step 3 uses Pareto analysis to identify that most occurrences are from the mold station and are caused by debris on the deculler die, a stuck mold cavity bar, or jamming at the V/M seesaw. Step 5 involves defect m
- Author
- Vbaluyo
- Language
- EN