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Optimizing Laser Dicing with ML Techniques by faizatul azwa is a document available to read on EtoBox.

The document presents a methodology developed to optimize laser dicing parameters for semiconductor manufacturing using machine learning. The methodology uses a design of experiments and machine learning algorithm to study the effects of key laser dicing parameters on dicing quality in a more efficient way than manual trial and error optimization.

Author
faizatul azwa
Language
EN