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The document discusses the evolution of silicon wafer cleaning technology, emphasizing the importance of clean surfaces for the fabrication of VLSI and ULSI circuits. It outlines the historical context, current cleaning methods, and advancements in techniques such as megasonic cleaning and centrifugal spray cleaning, while highlighting the persistent use of the RCA Standard Clean process. The paper also addresses the types and effects of contaminants on wafer surfaces and the necessity for effective cleanin

Author

Arvanris

Language

EN