About this scholarly article

Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004. - Process integration of CVD Cu seed using ALD Ru glue layer for sub-65nm Cu interconnect by Choi, S.-M.; Park, K.-C.; Suh, B.-S.; Kim, I.-R.; Kang, H.-K.; Suh, K.-P.; Park, H.-S.; Ha, J.-S.; Joo, D.-K. is a scholarly article available to read on EtoBox.

Author

Choi, S.-M.; Park, K.-C.; Suh, B.-S.; Kim, I.-R.; Kang, H.-K.; Suh, K.-P.; Park, H.-S.; Ha, J.-S.; Joo, D.-K.

Publisher

IEEE

Published

2004

Language

EN