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About this Materials Science article
Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints by Xu, Han; Zhang, Xudong; Chen, Wenjing; Zou, Minming; Hu, Xiaowu is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Xu, Han; Zhang, Xudong; Chen, Wenjing; Zou, Minming; Hu, Xiaowu
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0957-4522)
- Published
- 2020
- Field
- Materials Science (Physical Sciences)
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