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About this Engineering article
Materials Issues in the Multichip Module Packaging of Electronics by D. B. Knorr; D. R. Frear; W. L. Winterbottom is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- D. B. Knorr; D. R. Frear; W. L. Winterbottom
- Publisher
- The Minerals, Metals & Materials Society; Springer-Verlag; J O M Institute; Metallurgical Society of AIME; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 1047-4838)
- Published
- 1992
- Language
- EN
- Field
- Engineering (Physical Sciences)
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