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This study presents a method for preparing modified hexagonal boron nitride (m-BN) through wet ball milling, which enhances the thermal conductivity of epoxy resin. The m-BN exhibits improved dispersion and functional group content, leading to a thermal conductivity increase of approximately three times that of pure epoxy resin when milled for 8 hours. The findings suggest that both the size and dispersion of m-BN significantly influence the thermal and mechanical properties of the resulting epoxy composite

Author
xiafei907
Language
EN

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