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About this scholarly article
The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE - Si through-hole interconnections filled with Au-Sn solder by molten metal suction method by Yamamoto, S.; Itoi, K.; Suemasu, T.; Takizawa, T. is a scholarly article available to read on EtoBox.
- Author
- Yamamoto, S.; Itoi, K.; Suemasu, T.; Takizawa, T.
- Publisher
- IEEE
- Published
- 2003
- Language
- EN
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