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About this Engineering article
The Use of Organic Additives to Stabilize and Enhance the Deposition Rate of Electroless Copper Plating by Schoenberg, Leonard N. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Schoenberg, Leonard N.
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 1972
- Field
- Engineering (Physical Sciences)