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AM2022 - Issue1-FINAL2 Device Packaging by Tâm Lê is a document available to read on EtoBox.

What is AM2022 - Issue1-FINAL2 Device Packaging about?

The January/February 2022 issue of the Device Packaging journal features articles on heterogeneous IC packaging, the impact of silicon BEOL on solder fatigue life, and thermal interface materials in high-performance computing. It highlights the upcoming Device Packaging Conference (DPC 2022) and discusses advancements in packaging technologies, including chiplet integration and high-density fan-out solutions. The issue also includes updates from IMAPS and details on professional development courses and upco

Author

Tâm Lê

Language

EN