About this scholarly article

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Retarding electromigration on the Sn-Ag-Cu solder joints by micro-sized metal-particle reinforcement by Ma, Limin; Xu, Guangchen; Guo, Fu; Wang, Xitao is a scholarly article available to read on EtoBox.

Author

Ma, Limin; Xu, Guangchen; Guo, Fu; Wang, Xitao

Publisher

IEEE

Published

2011

Language

EN