About this scholarly article

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Copper-filled macroporous Si for microchannel heat sink tecnology by Zacharatos, Filimon; Nassiopoulou, Androula is a scholarly article available to read on EtoBox.

Author

Zacharatos, Filimon; Nassiopoulou, Androula

Publisher

IEEE

Published

2007