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About this Materials Science article
Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification by Hu, Xiaowu; Li, Ke; Min, Zhixian is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Hu, Xiaowu; Li, Ke; Min, Zhixian
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2013
- Language
- EN
- Field
- Materials Science (Physical Sciences)