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About this Engineering article
Erratum: “Thermomigration in flip-chip SnPb solder joints under alternate current stressing” [Appl. Phys. Lett. 90, 152105 (2007)] by H. Hsiao; C. Chen is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- H. Hsiao; C. Chen
- Publisher
- American Institute of Physics; AIP Publishing (ISSN 0003-6951)
- Published
- 2007
- Language
- EN
- Field
- Engineering (Physical Sciences)