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About this Engineering article
Thermomechanical finite element modeling of Cu-SiO2 direct hybrid bonding with a dishing effect on Cu surfaces by Beilliard, Y.; Estevez, R.; Parry, G.; McGarry, P.; Di Cioccio, L.; Coudrain, P. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Beilliard, Y.; Estevez, R.; Parry, G.; McGarry, P.; Di Cioccio, L.; Coudrain, P.
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0020-7683)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)
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