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About this Engineering article
An investigation of supercritical-CO2copper electroplating parameters for application in TSV chips by Chuang, Ho-Chiao; Lai, Wei-Hong; Sanchez, Jorge is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chuang, Ho-Chiao; Lai, Wei-Hong; Sanchez, Jorge
- Publisher
- Institute of Physics; IOP Publishing; Institute of Physics Publishing; ScienceOpen (ISSN 0960-1317)
- Published
- 2014
- Field
- Engineering (Physical Sciences)
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