About this scholarly article

2006 7th International Conference on Electronic Packaging Technology - Failure Analysis of In/Au Solder Joints by Ma, Lili; Bao, Shengxiang; Peng, Jing; Du, Zhibo is a scholarly article available to read on EtoBox.

Author

Ma, Lili; Bao, Shengxiang; Peng, Jing; Du, Zhibo

Publisher

IEEE

Published

2006