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About this Engineering article
Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures by Horváth, Barbara; Illés, Balázs; Shinohara, Tadashi is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Horváth, Barbara; Illés, Balázs; Shinohara, Tadashi
- Publisher
- Elsevier Science; Elsevier ; Elsevier Sequoia; Elsevier BV (ISSN 0040-6090)
- Published
- 2014
- Field
- Engineering (Physical Sciences)
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