About this scholarly article

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - A fine-grained co-simulation methodology for IR-drop noise in silicon interposer and TSV-based 3D IC by Song, Taigon; Lim, Sung Kyu is a scholarly article available to read on EtoBox.

Author

Song, Taigon; Lim, Sung Kyu

Publisher

IEEE

Published

2011

Language

EN