About this scholarly article

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Simulation Methods for Crack Initiation and Propagation in Bulk Mold Material of Electro Mechanical Components by Welschinger, Fabian; Gromala, Przemyslaw Jakub is a scholarly article available to read on EtoBox.

Author

Welschinger, Fabian; Gromala, Przemyslaw Jakub

Publisher

IEEE

Published

2016