About this document
Parallel Delayering Process Guide by Aiman Jamaluddin is a document available to read on EtoBox.
This document provides guidelines for using parallel delayering to remove thin film layers from semiconductor devices. It recommends starting with baseline recipe parameters for force, rpm, number of passes, and includes notes on defining the polishing region, leveling the sample, selecting the polishing tool size, determining the number of passes needed, and checking cloth wear. The goal is to develop a repeatable process for uniformly removing layers based on the specific device metallization and layout.
- Author
- Aiman Jamaluddin
- Language
- EN