About this scholarly article

Proceedings of Technical Program of 2012 VLSI Design, Automation and Test - 3D-IC BISR for stacked memories using cross-die spares by Chun-Chuan Chi, ; Yung-Fa Chou, ; Ding-Ming Kwai, ; Yu-Ying Hsiao, ; Cheng-Wen Wu, ; Yu-Tsao Hsing, ; Li-Ming Denq, ; Tsung-Hsiang Lin, is a scholarly article available to read on EtoBox.

Author

Chun-Chuan Chi, ; Yung-Fa Chou, ; Ding-Ming Kwai, ; Yu-Ying Hsiao, ; Cheng-Wen Wu, ; Yu-Tsao Hsing, ; Li-Ming Denq, ; Tsung-Hsiang Lin,

Publisher

IEEE

Published

2012