About this scholarly article

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials by Cadacio, F.; Rebibis, K. J.; Capuz, G.; Daily, R.; Gerets, C.; Sleeckx, E.; Duval, F.; Wang, T.; Miller, R. A.; Beyer, G.; Beyne, E. is a scholarly article available to read on EtoBox.

Author

Cadacio, F.; Rebibis, K. J.; Capuz, G.; Daily, R.; Gerets, C.; Sleeckx, E.; Duval, F.; Wang, T.; Miller, R. A.; Beyer, G.; Beyne, E.

Publisher

IEEE

Published

2014