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Plasmas and Plasma Enhanced CVD by Donald M. Mattox is a book available to read on EtoBox.

What is Plasmas and Plasma Enhanced CVD about?

The use of low-pressure plasmas is ubiquitous in vacuum coating. The plasma is used as a source of ions for sputtering, as an environment for "activating" reactive species for reactive vacuum deposition processes, and as a means for cleaning surfaces. In Chemical Vapor Deposition (CVD), which is normally performed at atmospheric pressure, chemical vapor precursors such as C 2 H 2 , SiH 4 , and B 2 H 6 may be used in vacuum to deposit coatings by pyrolysis (low-pressure CVD). The use of a plasma to "activate" the chemical vapor precursor (plasma enhanced CVD-PECVD) allows the deposition to progress at a lower temperature than is normally used for CVD. Ion bombardment of the depositing material during deposition may be used to control the properties of the CVD coating and if used requires a low-pressure plasma so the ions may be accelerated to a high energy. Combining low-pressure PECVD and various forms of PVD (sputtering, thermal evaporation, arc vaporization) gives a hybrid deposition process (PVD/PECVD) which allows the deposition of complex materials such as TiAlC x N y (Ti:Al carbonitride).

Author

Donald M. Mattox

Publisher

Elsevier

Published

2018

Language

EN