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About this Engineering article
Effects of Process Parameters on Bondability in Ultrasonic Ball Bonding by Jun Qi; Ngar Chun Hung; Ming Li; Deming Liu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jun Qi; Ngar Chun Hung; Ming Li; Deming Liu
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 1359-6462)
- Published
- 2006
- Field
- Engineering (Physical Sciences)