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About this Computer Science article
Thermal Conduction Module: A High-Performance Multilayer Ceramic Package by Blodgett, A. J.; Barbour, D. R. is a Computer Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Computer Science.
- Author
- Blodgett, A. J.; Barbour, D. R.
- Publisher
- IBM ; IBM Corp. (ISSN 0018-8646)
- Published
- 1982
- Language
- EN
- Field
- Computer Science (Physical Sciences)