About this scholarly article

Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures by Sayama, Toshihiko; Tsuritani, Hiroyuki; Okamoto, Yoshiyuki; Kinoshita, Masayoshi; Mori, Takao is a scholarly article available to read on EtoBox.

Author

Sayama, Toshihiko; Tsuritani, Hiroyuki; Okamoto, Yoshiyuki; Kinoshita, Masayoshi; Mori, Takao

Publisher

American Society of Mechanical Engineers

Published

2015