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What is IC Fabrication Process Steps Explained about?
The document describes the key steps involved in integrated circuit (IC) fabrication: 1. Wafer preparation and epitaxial growth prepare the silicon substrate. 2. Oxidation, photolithography, diffusion/implantation, and electrolysis modify the wafer and add components. 3. Metallization connects the components, glassing encapsulates the wafer, and probe testing verifies connections before completion. The multi-step fabrication process transforms a raw silicon wafer into a functional electrical circuit throug
- Author
- Shweth
- Language
- EN