13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Two-phase microgap cooling of a thermally-simulated microprocessor chip

Rahim, Emil; Bar-Cohen, Avram; Ali, Ihab Andre

doi:10.1109/itherm.2012.6231546

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13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Two-phase microgap cooling of a thermally-simulated microprocessor chip

by Rahim, Emil, Bar-Cohen, Avram, Ali, Ihab Andre

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Published2012

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13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Two-phase microgap cooling of a thermally-simulated microprocessor chip by Rahim, Emil; Bar-Cohen, Avram; Ali, Ihab Andre is a scholarly article available to read on EtoBox.

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Rahim, Emil; Bar-Cohen, Avram; Ali, Ihab Andre

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IEEE

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2012

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13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Two-phase microgap cooling of a thermally-simulated microprocessor chip

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13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Two-phase microgap cooling of a thermally-simulated microprocessor chip

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