Opening book details…
About this Engineering article
A Multi-scale Approach of the Thermo-mechanical Properties of Silica-filled Epoxies Used in Electronic Packaging by E.R. Weltevreden; S.J. Tesarski; A. Wymyslowski; M. Erinc; A.W.J. Gielen is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- E.R. Weltevreden; S.J. Tesarski; A. Wymyslowski; M. Erinc; A.W.J. Gielen
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2012
- Field
- Engineering (Physical Sciences)
More by E.R. Weltevreden; S.J. Tesarski; A. Wymyslowski; M. Erinc; A.W.J. Gielen
Browse all works by E.R. Weltevreden; S.J. Tesarski; A. Wymyslowski; M. Erinc; A.W.J. Gielen