About this Engineering article
Modelling the Effect of Plastic Anisotropy on Springback of Integrated Circuit Leadframes by Chan, K. C.; Wang, S. H. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chan, K. C.; Wang, S. H.
- Publisher
- Taylor and Francis Group; Hindawi Limited (ISSN 0730-3300)
- Published
- 1998
- Language
- EN
- Field
- Engineering (Physical Sciences)