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Template for CPG design guides Contents 3 List of Figures 5 List of Tables 7 Revision History 9 Chapter 1 Introduction 11 1.1 Objective 11 1.2 Related Information 12 1.3 Abbreviations 13 Chapter 2 Processor Package Descriptions 15 Chapter 3 Socket 754 Design Requirements 17 3.1 Socket 754 17 3.2 Base and Cover 19 3.2.1 Socket 754 Vendor Marking 19 3.2.2 Other Socket 754 Markings 20 3.3 Socket 754 Contact Material and Plating 20 Chapter 4 Socket 754 Qualification Requirements 21 4.1 Qualification Test Report 21 4.2 Testing 21 Chapter 5 Documentation Requirements 23 Chapter 6 Mechanical Test Procedure Conditions and Requirements 25 6.1 Test Matrix 25 Chapter 7 Electrical Qualification Requirements 31 7.1 Fixture 31 7.1.1 Capacitance And Inductance Matrices 31 7.1.2 Mated Partial Self-Inductance 32 7.1.3 Mated Loop Inductance 32 7.1.4 Mated Partial Loop Inductance Matrix 32 7.2 Differential Impedance Definition 34 7.2.1 Differential Impedance 34 7.3 Differential and Single-Ended Crosstalk 35 7.3.1 Test Procedure 35 7.3.2 Test Condition 35 7.3.3 Requirements 35 7.4 Propagation Delay Skew 35 7.4.1 Single-Ended Propagation Delay Skew 36 7.4.2 Differential Propagation Delay Skew 37 7.5 Ca
- Author
- AMD
- Language
- EN
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