About this scholarly article

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Reduction of Cu-Ni-Pd pad discoloration caused by Cu re-deposition by Clemente, Laura May Antoinette; Zeng, Kejun; Nangia, Amit is a scholarly article available to read on EtoBox.

Author

Clemente, Laura May Antoinette; Zeng, Kejun; Nangia, Amit

Publisher

IEEE

Published

2016