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Interdevice isolation characteristics for design and fabrication of 60-GHz WPAN SoCs by Sungil Kim; Chul-Wook Lee; Suck-Won Yun; Kwang-Yong Kang; Hai-Young Lee is a Engineering article available to read on EtoBox.

What is Interdevice isolation characteristics for design and fabrication of 60-GHz WPAN SoCs about?

## Abstract The high interdevice isolation levels is one of the key technologies in the design and fabrication of 60‐GHz WPAN SoC. To obtain proper interdevice isolation levels, we have analyzed and measured substrate coupling effects with various isolation techniques like a trench and implant structure. From the analyzed and measured results, the feasibility of the implant has confirmed to be applicable to the mm‐wave SoC, and also derived an equivalent circuit form these results, which can be helpful to the design and fabrication of the 60‐GHz WPAN SoC. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1699–1702, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23470

Who reads Interdevice isolation characteristics for design and fabrication of 60-GHz WPAN SoCs?

Author

Sungil Kim; Chul-Wook Lee; Suck-Won Yun; Kwang-Yong Kang; Hai-Young Lee

Publisher

John Wiley and Sons; Wiley (John Wiley & Sons); John Wiley & Sons Inc.; Wiley (ISSN 0895-2477)

Published

2008

Language

EN

Field

Engineering (Physical Sciences)