Opening book details…
About this Materials Science article
Photo and Thermal Cured Silicon‐Containing Diethynylbenzene Fibers via Melt Electrospinning with Enhanced Thermal Stability by Li, Zhefu; Yuan, Yichun; Chen, Binling; Liu, Yong; Nie, Jun; Ma, Guiping is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Li, Zhefu; Yuan, Yichun; Chen, Binling; Liu, Yong; Nie, Jun; Ma, Guiping
- Publisher
- John Wiley and Sons; Wiley (John Wiley & Sons); John Wiley & Sons Inc.; Wiley (ISSN 0887-624X)
- Published
- 2017
- Field
- Materials Science (Physical Sciences)
More by Li, Zhefu; Yuan, Yichun; Chen, Binling; Liu, Yong; Nie, Jun; Ma, Guiping
Browse all works by Li, Zhefu; Yuan, Yichun; Chen, Binling; Liu, Yong; Nie, Jun; Ma, Guiping