About this scholarly article

2017 IEEE MTT-S International Microwave Symposium (IMS) - 3D heterogeneous integration technology using hot via MMIC and silicon interposer with millimeter wave application by Zhou, Jun; Yang, Jiapeng; Shen, Ya is a scholarly article available to read on EtoBox.

Author

Zhou, Jun; Yang, Jiapeng; Shen, Ya

Publisher

IEEE

Published

2017