About this Engineering article
Improvement in the Adhesion Between Copper Metal and Polyimide Substrate by Plasma Polymer Deposition of Cyano Compounds Onto Polyimide by Inagaki, N.; Tasaka, S.; Ohmori, H.; Mibu, S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Inagaki, N.; Tasaka, S.; Ohmori, H.; Mibu, S.
- Publisher
- Taylor and Francis Group; Informa UK (Taylor & Francis); Taylor & Francis; Informa UK Limited; Brill (ISSN 0169-4243)
- Published
- 1996
- Language
- EN
- Field
- Engineering (Physical Sciences)