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About this Engineering article
Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer by Kang, Ren Ke; Gao, Shang; Jin, Zhu Ji; Guo, Dong Ming is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kang, Ren Ke; Gao, Shang; Jin, Zhu Ji; Guo, Dong Ming
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications Ltd. (ISSN 1662-9795)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)
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