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Finite Element Modeling of Adhesive Contact Using Molecular Potential by Sung-San Cho; Seungho Park is a Engineering article available to read on EtoBox.
What is Finite Element Modeling of Adhesive Contact Using Molecular Potential about?
A finite element technique for analysis of adhesive contact is developed in which the adhesive force is modeled as a body force derived from Lennard-Jones 12-6 potential. Adhesive contact of an elastic hemispherical asperity with the plane surface of a semi-infinite rigid body is analyzed. Variations of the interaction force and contact radius during approach and withdrawal, and the dependence of pull-off force on the asperity radius are shown to be in good agreement with those of Maugis-Dugdale model. Analysis results reveal that smaller asperity is superior for preventing stiction and for reducing adhesive friction, but is subject to more severe adhesive wear. It is anticipated that this technique can be utilized in designing a low-adhesion surface profile for MEMS applications since the effect of various surface geometries can be examined.
Who reads Finite Element Modeling of Adhesive Contact Using Molecular Potential?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sung-San Cho; Seungho Park
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0301-679X)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)