About this Engineering article
Stress Migration Lifetime for Cu Interconnects With CoWP-Only Cap by Gambino, J.P.; Johnson, C.L.; Therrien, J.E.; Hunt, D.B.; Wynne, J.E.; Smith, S.; Mongeon, S.A.; Pokrinchak, D.P.; Levin, T.M. is a Engineering article available to read on EtoBox.
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- Author
- Gambino, J.P.; Johnson, C.L.; Therrien, J.E.; Hunt, D.B.; Wynne, J.E.; Smith, S.; Mongeon, S.A.; Pokrinchak, D.P.; Levin, T.M.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1530-4388)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)