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About this Engineering article

The Acceleration of Nonformaldehyde Electroless Copper Plating [Journal of The Electrochemical Society, 149, C631 (2002)] by Li, Jun; Kohl, Paul A. is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Li, Jun; Kohl, Paul A.
Publisher
The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
Published
2003
Field
Engineering (Physical Sciences)

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