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About this Materials Science article
Nanoscale deformation analysis near crack-tip under residual stress in Si by high-resolution transmission electron microscopy by D. S. Liu, C. W. Zhao, W. H. Du is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- D. S. Liu, C. W. Zhao, W. H. Du
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0957-4522)
- Published
- 2012
- Field
- Materials Science (Physical Sciences)