About this scholarly article

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Cost and yield analysis of multi-die packaging using 2.5D technology compared to fan-out wafer level packaging by Palesko, Chet; Palesko, Amy; Vardaman, E. Jan is a scholarly article available to read on EtoBox.

Author

Palesko, Chet; Palesko, Amy; Vardaman, E. Jan

Publisher

IEEE

Published

2014