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About this Engineering article
Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation by Su, R.; Li, L.; Nie, Z. H.; Zhang, Q. H.; Wang, Y. D.; Zhou, X. T.; Wu, Y. D.; Hui, X. D.; Li, X. J.; Wang, M. G. is a Engineering article available to read on EtoBox.
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- Author
- Su, R.; Li, L.; Nie, Z. H.; Zhang, Q. H.; Wang, Y. D.; Zhou, X. T.; Wu, Y. D.; Hui, X. D.; Li, X. J.; Wang, M. G.
- Publisher
- American Institute of Physics; AIP Publishing (ISSN 0003-6951)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)