About this scholarly article

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) - Drop/impact simulation and test validation of telecommunication products by Wu, J.; Song, G.; Yeh, C.-P.; Wyatt, K. is a scholarly article available to read on EtoBox.

Author

Wu, J.; Song, G.; Yeh, C.-P.; Wyatt, K.

Publisher

IEEE

Published

1998