About this scholarly article

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Assessing the remnant of anti-oxidant agent on the processed copper bond pad surface by using XPS and TEM analysis by Yung, Lai Chin; Fei, Cheong Choke is a scholarly article available to read on EtoBox.

Author

Yung, Lai Chin; Fei, Cheong Choke

Publisher

IEEE

Published

2016

Language

EN